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TM 9-254
4-16.
Tinning Wire - Continued
(4)
Secure the wire to be tinned with a heat shunt (fig. 4-33). The use of a heat shunt will prevent solder
from flowing beneath the insulation during tinning and soldering operations. Solder flow under the
insulation is called wicking and is not permitted.
Figure 4-33. Using a Heat Shunt
(5)
Tin the wire (fig. 4-34) with a soldering iron by placing the exposed center conductor on the soldering
iron tip until the center conductor becomes hot enough to melt solder. Apply solder all along the top of
the center conductor until solder flows freely and evenly over and around the length to be tinned.
Figure 4-34. Wire Tinning
4-39
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