|
| |
TM 9-254
4-12.
Soldering Station - Continued
(2)
Plug the cord (11) into the power unit base (7). Plug power cord (5) into electrical outlet.
(3)
Turn on power switch (6) and allow soldering tip (3) to heat.
(4)
Apply water to sponge (9) and remove soldering iron (1) from iron holder (10) and wipe tip (3) across
sponge to clean off any foreign material.
NOTE
When soldering electrical parts and wiring, always use a rosin core solder or solid solder with a
rosin flux.
(5)
Rub rosin core solder over the face of the tip (3). As soon as the temperature rises sufficiently, the
solder will melt and spread smoothly over the face of the tip. The purpose of this procedure is to tin the
tip as soon as it becomes hot enough to melt solder and before it has had a chance to oxidize.
(6)
When the tinning is complete, wipe the tip (3) across the sponge (9) while the solder is hot and molten.
This will expose an even, almost mirror like layer of molten solder on the tip face.
4-13.
Soldering Techniques.
a.
Using a Soldering Iron. Soldering can be broken down into seven major steps which include: precleaning,
applying flux, applying heat, applying solder, cooling, flux removal, and inspection.
(1)
Precleaning. The work which is to be soldered must be perfectly clean. All oxide must be scraped off
with a steel scratch brush, emery paper, steel wool, file or a knife, whichever works best for the
particular job. Grease, dust, and oil must be removed from surfaces to be soldered with noncorrosive
solvents such as trichloroethane, or alcohol.
(2)
Applying flux. Flux must wet the entire surface to which the solder is to adhere. When used, liquid flux
must be applied in a thin even coat to the surfaces being joined prior to the application of heat. When
using cored solder wire, place solder in a position that will allow the flux to flow over the joint as the
solder melts.
NOTE
o
Some electronic components are heat sensitive and could be destroyed by heat. For
this reason, a heat sink device such as surgical tweezers, needle nose pliers, or heat
sinks should always be applied between the solder joint and the electronic component.
o
If a soldering iron becomes too cool to solder, it is too small for the job and an iron
with a higher wattage rating or a higher tip temperature should be used.
4-28
|
