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Figure 4-33.  Using a Heat Shunt
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TM-9-254 Gearcase Transfer M548 M548A1 (
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Figure 4-36.  Printed Circuit Board Holder
TM 9-254 4-16. Tinning Wire - Continued (6) Remove the wire from the soldering iron and allow it to cool before removing heat shunt from the wire. Clean tinned wire with alcohol and a medium stiff bristle brush to remove all flux residue. (7) Clean the inside of the clamping jaws of the heat shunt (fig. 4-33) with alcohol and a medium stiff bristle brush to remove all flux residue. (8) Inspect tinned wire for a smooth even layer of solder (fig. 4-35).  The solder coverage on the wire must be  thin  enough  to  show  wire  strands.    Solder  coating  must  not  extend  under  insulation.    Wicking (sucking of solder up along the strands during the tinning process) often makes the solder flow farther than intended and results in solder under the insulation.  Wicking must be avoided. Figure 4-35.  Tinned Wires - Examples 4-17. Printed Circuit Boards. a. Printed  Circuit  Board  Holders  (fig.  4-36).    To  prevent  damage  during  assembly  and  inspection,  the  circuit board should be held by a jig or fixture. This will prevent it from bending, warping, or deforming in any manner.  The jig or fixture  will  permit  the  circuit  board  to  be  held  at  each  end  and  fixed  at  any  desired  position  by  use  of  the  wing-nut  set screws in the shaft bearings. 4-40

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